Honor’s Magic V2 has held the title of the thinnest large-format foldable smartphone since its release last July, with a folded thickness of 9.9mm. However, Honor is set to outdo itself with the upcoming Magic V3, promising an even slimmer design. According to a tipster, the Magic V3 will be between 9mm and 9.98mm thick and will feature the Snapdragon 8 Gen 3 chipset, “5.5G” and satellite connectivity in China, a weight of 220-229g, a 5,000-5,990 mAh battery with 66W charging, a 50 MP “eagle eye camera,” and an “ultra-thin” USB Type-C port. The launch is expected in July, as indicated by the recent teaser campaign.
Read more – https://www.gsmarena.com/honor_magic_v3_will_be_even_thinner_than_v2_teaser_reveals-news-63462.php
