Samsung has announced a new LPDDR5X DRAM chip, the thinnest in its category, available in 12 GB and 16 GB packages. At 0.65 mm thin, it is 9% thinner than its predecessor and improves cooling by 21.2%. Designed for low-power RAM markets, especially smartphones with on-device AI, the chip uses optimized PCB and epoxy molding techniques in a 4-stack structure. Samsung is already shipping these chips and plans to develop even thinner 6-layer 24 GB and 8-layer 32 GB modules for future devices.
Read more – https://www.gsmarena.com/samsung_introduces_the_thinnest_lpddr5x_dram_for_ai_smartphones-news-64001.php
