Qualcomm unveiled its new FastConnect 8800 connectivity chip at Mobile World Congress 2026, becoming the first mobile solution to support Wi-Fi 8, Bluetooth 7, Ultra Wideband 802.15.4ab and Thread 1.5 in one chip.
Built on a 6nm process with a new 4×4 radio design, FastConnect 8800 delivers peak speeds up to 11.6 Gbps and up to three times the range of current chips, alongside new Wi-Fi 8 features like Extended Long Range (ELR). Bluetooth 7 support boosts wireless speeds to 7.5 Mbps and enables high-resolution audio via Snapdragon Sound technologies such as aptX Lossless and aptX Adaptive.
The chip could debut in future flagship platforms like the next Snapdragon 8 Elite generation, with commercial devices expected to arrive from late 2026.
Source: Android Authority
